Tong Hsing Electronic Industries Recruiting
| Job | Demand Department | Content |
| Layout Engineers | Engineering |
1.Substrate circuit layout and design
2. Library establishment and maintenance / part layout
3.substrate contract drawing and engineering issues reply
|
| Advanced Packaging Engineers | Engineering |
1. Compatible with the process for evaluating new materials
2. New process development and planning
3. New product reliability research and structural mechanism derivation
4. New product development
|
| Module Package Engineers | Engineering |
1. APQP, Product Planning Management
2. New product introduction and trial production
3. Sample process improvement
4. Project plan evaluation and specification
|
| Electroplating Engineers |
Chemistry, Materials, Chemical Engineering | 1. Product planning
2. Process Evaluation and Improvement
3. Project Assessment and Product Specification Development
|
| Electroplating process engineers | Chemistry, Materials, Chemical Engineering |
1. Electroplating of copper, nickel, and film removal etching process maintenance and continuous improvement
2. Evaluate the process plan and plan the most appropriate manufacturing process
3. Regularly check the key parameters of the process equipment
4. Continuously improve the existing production process
|
| Automation Control Engineers | Electronic、Electrical、Mechanical Engineering |
1. Manage robot arm related software and applications
2. Advance verification of robotic arm automation equipment
3. Visual alignment software editing
|